Assembly
What we offer:
6 complete SMT Hanwa (Samsung) lines with Pick & Place technology, laser marking of PCB/FPCs
SMT: 1.500.000 components per shift (optimum is 450.000 CPH)
THT: 25.000 components per shift
Controlled storage of MSD components
Assembly of big PCBs to the size of 609×508 mm
min. pitch 0,5 mm for QFP a 1 mm for BGA 3D
ESD protection, temperature and humidity control
Control of paste printing with 3D SPI with a closed loop for screen printing
Our production equipment:
CONTACTS
T: +420 386 721 230
electronics@tse.cz
© TSE ELECTRONICS 2018